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 BUZ 104 S
SPP14N05
SIPMOS (R) Power Transistor
* N channel * Enhancement mode * Avalanche-rated * dv/dt rated * 175C operating temperature * also in SMD available
Pin 1 Pin 2 Pin 3
G
D
S
Type
VDS 55 V
ID 13.5 A
RDS(on) 0.1
Package
Ordering Code
BUZ 104 S
TO-220 AB
Q67040-S4007-A2
Maximum Ratings Parameter Symbol Values Unit
Continuous drain current
TC = 25 C TC = 100 C
ID
A 13.5 9.6
Pulsed drain current
TC = 25 C
IDpuls
54
E AS
Avalanche energy, single pulse
ID = 13.5 A, VDD = 25 V, RGS = 25 L = 571 H, Tj = 25 C
mJ
52
IAR E AR
Avalanche current,limited by Tjmax Avalanche energy,periodic limited by Tjmax Reverse diode dv/dt
IS = 13.5 A, V DS = 40 V, diF/dt = 200 A/s Tjmax = 175 C
13.5 3.5
A mJ kV/s
dv/dt
6
V GS P tot
Gate source voltage Power dissipation
TC = 25 C
20
35
V W
Semiconductor Group
1
29/Jan/1998
BUZ 104 S
SPP14N05
Maximum Ratings Parameter Symbol Values Unit
Operating temperature Storage temperature Thermal resistance, junction - case Thermal resistance, junction - ambient IEC climatic category, DIN IEC 68-1
Tj Tstg RthJC RthJA
-55 ... + 175 -55 ... + 175
C
4.3 62
55 / 175 / 56
K/W
Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Values typ. max. Unit
Drain- source breakdown voltage
V GS = 0 V, ID = 0.25 mA, Tj = 25 C
V (BR)DSS
V 55 -
Gate threshold voltage
V GS=V DS, ID = 20 A
V GS(th)
2.1
IDSS
3
4 A
Zero gate voltage drain current
V DS = 50 V, V GS = 0 V, Tj = -40 C V DS = 50 V, V GS = 0 V, Tj = 25 C V DS = 50 V, V GS = 0 V, Tj = 150 C
IGSS
0.1 -
0.1 1 100 nA
Gate-source leakage current
V GS = 20 V, VDS = 0 V
RDS(on)
10
100
Drain-Source on-resistance
V GS = 10 V, ID = 9.6 A
0.076 0.1
Semiconductor Group
2
29/Jan/1998
BUZ 104 S
SPP14N05
Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Values typ. max. Unit
Dynamic Characteristics
Transconductance
V DS 2 * ID * RDS(on)max, ID = 9.6 A
gfs
S 4 pF 270 340
Input capacitance
V GS = 0 V, V DS = 25 V, f = 1 MHz
Ciss
Output capacitance
V GS = 0 V, V DS = 25 V, f = 1 MHz
Coss
Crss
95
120
Reverse transfer capacitance
V GS = 0 V, V DS = 25 V, f = 1 MHz
td(on)
50
65 ns
Turn-on delay time
V DD = 30 V, VGS = 10 V, ID = 13.5 A RG = 33
tr
9
15
Rise time
V DD = 30 V, VGS = 10 V, ID = 13.5 A RG = 33
td(off)
22
35
Turn-off delay time
V DD = 30 V, VGS = 10 V, ID = 13.5 A RG = 33
tf
18
30
Fall time
V DD = 30 V, VGS = 10 V, ID = 13.5 A RG = 33
Qg(th)
16.5
25 nC
Gate charge at threshold
V DD = 40 V, ID = 0.1 A, V GS =0 to 1 V
Qg(7)
0.33
0.5
Gate charge at 7.0 V
V DD = 40 V, ID = 13.5 A, V GS =0 to 7 V
Qg(total)
7.11
11
Gate charge total
V DD = 40 V, ID = 13.5 A, V GS =0 to 10 V
V (plateau)
9.5
14 V
Gate plateau voltage
V DD = 40 V, ID = 13.5 A
Semiconductor Group
3
5.9
29/Jan/1998
BUZ 104 S
SPP14N05
Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Reverse Diode Values typ. max. Unit
Inverse diode continuous forward current
TC = 25 C
IS
A 13.5
Inverse diode direct current,pulsed
TC = 25 C
ISM
V SD
-
54 V
Inverse diode forward voltage
V GS = 0 V, IF = 27 A
trr
1.17
1.8 ns
Reverse recovery time
V R = 30 V, IF=lS, diF/dt = 100 A/s
Qrr
50
75 C
Reverse recovery charge
V R = 30 V, IF=lS, diF/dt = 100 A/s
-
0.1
0.15
Semiconductor Group
4
29/Jan/1998
BUZ 104 S
SPP14N05
Power dissipation Ptot = (TC)
Drain current ID = (TC) parameter: VGS 10 V
14 A
36 W Ptot 28 24 20 16 12 8 4 0 0 20 40 60 80 100 120 140 C 180 ID
12 11 10 9 8 7 6 5 4 3 2 1 0 0 20 40 60 80 100 120 140 C 180
TC
TC
Safe operating area ID = (VDS) parameter: D = 0, TC = 25C
10 2
t = 3.3s p
Transient thermal impedance Zth JC = (tp) parameter: D = tp / T
10 1
10 1
R
DS (o n)
ID
V
DS
A
=
/I
K/W ZthJC
D
10 s
10 0
100 s
10 -1 D = 0.50 0.20
10
0
1 ms 10 ms
0.10 10 -2 single pulse 0.05 0.02 0.01
DC
10 -1 0 10
10
1
V 10
2
10 -3 -7 10
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
s 10
0
VDS
tp
Semiconductor Group
5
29/Jan/1998
BUZ 104 S
SPP14N05
Typ. output characteristics ID = (VDS) parameter: tp = 80 s , Tj = 25 C
30 A 26 ID 24 22 20 18 16 14 12 10 8 6 4 2 0
c b a e g i
Typ. drain-source on-resistance RDS (on) = (ID) parameter: tp = 80 s, Tj = 25 C
0.32
Ptot = 35W
l
k
j
VGS [V] a b c 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0
a
b
c
d
e
f
g
h
RDS (on) 0.24
hd
e f g
0.20
0.16
fh
i j
0.12
i j
k 10.0
d l 20.0
0.08
k
0.04 VGS [V] =
a 4.0 4.5 b 5.0 c 5.5 d 6.0 e f 6.5 7.0 g 7.5 i h j k 8.0 9.0 10.0 20.0
0.00 V 5.0 0 4 8 12 16 20 A 26
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
VDS
ID
Typ. transfer characteristics ID = f (V GS)
parameter: tp = 80 s
VDS2 x ID x RDS(on)max
35
A
I
D
25
20
15
10
5
0 0
1
2
3
4
5
6
7
8
V
VGS
10
Semiconductor Group
6
29/Jan/1998
BUZ 104 S
SPP14N05
Drain-source on-resistance RDS (on) = (Tj ) parameter: ID = 9.6 A, VGS = 10 V
0.32
Gate threshold voltage
V GS(th)= f (Tj)
parameter:VGS=VDS, ID =20A
5.0 V 4.4
VGS(th)
RDS (on) 0.24
4.0 3.6
0.20
3.2 2.8
0.16 98% 0.12 typ
2.4 2.0 1.6
max
0.08
typ
1.2 0.8
0.04 0.4 0.00 -60 -20 20 60 100 C 180 0.0 -60 -20 20 60 100 140 V
Tj
min
200
Tj
Typ. capacitances
C = f (VDS)
parameter:VGS = 0V, f = 1MHz
10 3
Forward characteristics of reverse diode IF = (VSD) parameter: Tj , tp = 80 s
10 2
A
C
pF
Ciss
IF 10 1
10 2
Coss
Crss
10 0 Tj = 25 C typ Tj = 175 C typ Tj = 25 C (98%) Tj = 175 C (98%)
10 1 0
5
10
15
20
25
30
V
VDS
40
10 -1 0.0
0.4
0.8
1.2
1.6
2.0
2.4
V
3.0
VSD
Semiconductor Group
7
29/Jan/1998
BUZ 104 S
SPP14N05
Avalanche energy EAS = f (Tj) parameter:ID=13.5 A,VDD =25 V RGS =25 , L = 571 H
60
Typ. gate charge VGS = (QGate) parameter: ID puls = 14 A
16
V mJ
EAS
VGS 40
12
10 0,2 VDS max 30 8 0,8 VDS max
6 20 4 10 2 0 20 40 60 80 100 120 140 C
Tj
0 180 0 1 2 3 4 5 6 7 nC 9
Q Gate
Drain-source breakdown voltage V(BR)DSS = (Tj)
65
V V(BR)DSS
61
59
57
55
53
51 49 -60
-20
20
60
100
C
180
Tj
Semiconductor Group
8
29/Jan/1998


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